MEMS DEVICE ASSEMBLY AND METHOD OF PACKAGING THE SAME

PROBLEM TO BE SOLVED: To provide a method of making microelectromechanical system (MEMS) device packages.SOLUTION: A MEMS device is formed on a front side of a first substrate. A portion of the substrate partially surrounding an active region of the MEMS device is removed. A cantilevered substrate p...

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Hauptverfasser:	SCHLARMANN MARK E, MCNEIL ANDREW C, DESAI HEMANT D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of making microelectromechanical system (MEMS) device packages.SOLUTION: A MEMS device is formed on a front side of a first substrate. A portion of the substrate partially surrounding an active region of the MEMS device is removed. A cantilevered substrate platform at which the active region resides is thereby formed. A back side of the first substrate is attached to a second substrate. During the attaching, a clearance space is formed between the cantilevered substrate platform and the second substrate. The cantilevered substrate platform is thereby suspended above the second substrate.