CAMERA MODULE

PROBLEM TO BE SOLVED: To provide a camera module lower in height even though being capable of forming an image of high image quality and low in cost.SOLUTION: A peripheral part of a glass substrate 14 is covered over the whole periphery by an adhesive 17 as connection light-shielding means for conne...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: HASHINO HIROYOSHI
Format: Patent
Sprache:eng
Schlagworte:
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