CAMERA MODULE

PROBLEM TO BE SOLVED: To provide a camera module lower in height even though being capable of forming an image of high image quality and low in cost.SOLUTION: A peripheral part of a glass substrate 14 is covered over the whole periphery by an adhesive 17 as connection light-shielding means for conne...

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Bibliographische Detailangaben
1. Verfasser:	HASHINO HIROYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM CINEMATOGRAPHY ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY ELECTROGRAPHY HOLOGRAPHY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHOTOGRAPHY PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a camera module lower in height even though being capable of forming an image of high image quality and low in cost.SOLUTION: A peripheral part of a glass substrate 14 is covered over the whole periphery by an adhesive 17 as connection light-shielding means for connecting the glass substrate 14 to other components or a lens barrel 13, so that while strong structure of a camera module 10 is secured, generation of a ghost due to intrusion of unnecessary light from the peripheral part of the glass substrate 14 can also be suppressed.