SUSPENDED LATTICE FOR ELECTRICAL INTERCONNECTION

PROBLEM TO BE SOLVED: To increase reliability of interconnection between electrical connection points on circuit substrates based on a conductive resin.SOLUTION: An embodiment has a circuit substrate, and an electrical connection point 202 on the circuit substrate. The electrical connection point 20...

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Bibliographische Detailangaben
Hauptverfasser:	CHAD JOHAN SLENES, CHAD DAVID FREITAG, TYGH JAMES NEWTON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To increase reliability of interconnection between electrical connection points on circuit substrates based on a conductive resin.SOLUTION: An embodiment has a circuit substrate, and an electrical connection point 202 on the circuit substrate. The electrical connection point 202 includes a lattice 212 of conductive material, the lattice 212 being adjacent to a gap in the circuit substrate and having anchor points of cover lay 220 material that are attached to the circuit substrate. A conductive epoxy resin encapsulates at least a portion of the lattice 212 of the conductive material.