ELECTRONIC COMPONENT MOUNTING DEVICE

PROBLEM TO BE SOLVED: To reliably recognize the image only of an inspected component at the tip of a suction nozzle, in an electronic component mounting device configured so that the optical axis of the optical system, in a side imaging means for imaging the tip part of the suction nozzle for suckin...

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Bibliographische Detailangaben
1. Verfasser:	HATASE TAKAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To reliably recognize the image only of an inspected component at the tip of a suction nozzle, in an electronic component mounting device configured so that the optical axis of the optical system, in a side imaging means for imaging the tip part of the suction nozzle for sucking an electronic component, makes a predetermined angle from above.SOLUTION: In the surface mounting device for mounting an electronic component B1 sucked by a suction nozzle A on a printed board C, side imaging means capable of imaging the tip part of the suction nozzle A from the side is provided. The optical axis of the optical system D in the side imaging means is not parallel with the suction surface of the suction nozzle A, and images an electronic component B from above so as to make a predetermined angle . The illumination system E of the side imaging means emits illumination light so as not to impinge on the electronic component B2 other than the electronic component B1 sucked by the suction nozzle A, within the field of view of the side imaging means.