FLEXIBLE CIRCUIT COPPER CLAD LAMINATE, PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a flexible circuit copper clad laminate showing excellence in etching property, peeling strength and curl characteristic.SOLUTION: A flexible circuit copper clad laminate contains a polymer film 1, a tie coat layer 2 formed on at least one surface of the polymer film...

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Bibliographische Detailangaben
Hauptverfasser:	OH WON KEUN, JUNG HO YOUNG, KIM TAE HYUN, KIM KYUNG KAK, BANG SUNG HWAN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a flexible circuit copper clad laminate showing excellence in etching property, peeling strength and curl characteristic.SOLUTION: A flexible circuit copper clad laminate contains a polymer film 1, a tie coat layer 2 formed on at least one surface of the polymer film 1, and a copper layer 3 formed on the tie coat layer 2. The tie coat layer 2 is composed of an alloy containing: either one substance selected from iron, niobium and cobalt; molybdenum; and nickel.