EVAPORATION SOURCE, EVAPORATION SOURCE ASSEMBLY AND VAPOR DEPOSITION APPARATUS

PROBLEM TO BE SOLVED: To provide an evaporation source which can prevent a vapor deposition material from being condensed in a nozzle.SOLUTION: The evaporation source includes: a housing 60 of which one surface is opened; a storing part 20 positioned inside the housing 60, in which an organic matter...

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Hauptverfasser:	CHO GENSHAKU, AHN JAE HONG, JEONG SEOK-HEON, LEE SEIKO, KO KITETSU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an evaporation source which can prevent a vapor deposition material from being condensed in a nozzle.SOLUTION: The evaporation source includes: a housing 60 of which one surface is opened; a storing part 20 positioned inside the housing 60, in which an organic matter is stored, and of which one surface is opened; a nozzle 30 coupled to the opened part of the storing part 20 and injecting the vapor deposition material; and a heater 40 interposed between the storing part 20 and the housing 60.