SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND PROCESSING DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method which includes a process of forming metal electrodes for external connection on base electrodes by cutting or grinding processing, and which can inhibit defects such as element malfunction.SOLUTION: A semiconductor device manufacturing method comprises: forming base electrodes electrically connected with an element; forming a protection film having openings for exposing a part of each base electrode and openings corresponding to scribe regions of the semiconductor substrate so as to cover the base electrodes; subsequently, forming a metal film so as to cover the protection film including the openings; forming metal electrodes for external connection at openings corresponding to the base electrodes by patterning the metal film by cutting or grinding while leaving the metal film at side wall surfaces and bottom faces of the openings corresponding to the scribe regions; selectively removing the metal film left on the side wall surfaces and the bottom faces of the openings corresponding to the scribe regions; and subsequently, dicing the semiconductor substrate along the scribe regions.