MANUFACTURING METHOD OF PACKED ELECTRODE, PACKED ELECTRODE, SECONDARY BATTERY, AND HEAT SEALING DEVICE

MANUFACTURING METHOD OF PACKED ELECTRODE, PACKED ELECTRODE, SECONDARY BATTERY, AND HEAT SEALING DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method of a packed electrode capable of bonding a separator with a heat-resistant layer.SOLUTION: A portion where a separator layer 48 composed of a resin material,interposed between heat-resistant layers 49 is superimposed, is held by a pair of weldi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SAWADA YASUHIRO, WAKAI KOHEI, KUSHIMA KAZUSANE, KIM TAE-WON, TERADO MIYUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRICITY
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a manufacturing method of a packed electrode capable of bonding a separator with a heat-resistant layer.SOLUTION: A portion where a separator layer 48 composed of a resin material,interposed between heat-resistant layers 49 is superimposed, is held by a pair of welding chips 120 and hot pressed. The heat-resistant layers 49 are broken by the welding chips 120, and when it is heated, resin of the separator layer 48 is melted from the broken part 200 and bonds the separator layer 48.