ULTRASONIC WAVE TRANSCEIVER

PROBLEM TO BE SOLVED: To provide an ultrasonic wave transceiver which inhibits the destruction of a solder part between a metal pin terminal and a circuit board and prevents a liquid sealant from changing microphone characteristics even when an ultrasonic wave transmitting and receiving surface is p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIGEMORI TAKUMI, SHIMIZU YOSHITAKA, NOGUCHI KOJI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an ultrasonic wave transceiver which inhibits the destruction of a solder part between a metal pin terminal and a circuit board and prevents a liquid sealant from changing microphone characteristics even when an ultrasonic wave transmitting and receiving surface is pushed down in a vertical direction by the metal pin terminal.SOLUTION: An ultrasonic wave transceiver is formed so as to have a structure that allows a metal pin terminal 6 to be inserted between a resin cap 8 of a housing 11 housing a unimorph vibrator and a circuit board 12, is provided with a through hole smaller than an outer periphery of the resin cap 8, and allows a rear surface of the resin cap 8 to contact with the housing 11. This structure prevents the resin cap 8 and the metal pin terminal 6 from moving in the circuit board 12 direction without increasing the number of components. Further, a contact part between the rear surface of the resin cap 8 and the housing 11 dams a liquid sealant 14, thereby preventing the changes of the microphone characteristics.