AQUEOUS SOLUTION FOR SURFACE TREATMENT OF METAL AND METHOD FOR PREVENTING DISCOLORATION OF METAL SURFACE

PROBLEM TO BE SOLVED: To provide a plating film having good solder wettability and a method for forming the same with which there is no twisting of the plating film, and discoloration is controlled, even after reflow treatment of a tin or tin alloy plating film used in electronic components.SOLUTION...

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Bibliographische Detailangaben
1. Verfasser:	ORIHASHI MASANORI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a plating film having good solder wettability and a method for forming the same with which there is no twisting of the plating film, and discoloration is controlled, even after reflow treatment of a tin or tin alloy plating film used in electronic components.SOLUTION: A tin film on a surface of a substrate is treated with an aqueous solution containing L-arginine and having a pH of 7 to 12 before the reflow treatment, and then the tin film is subjected to the reflow treatment.