MOLD AND METHOD FOR MOLDING ARTICLE TO BE MOLDED

PROBLEM TO BE SOLVED: To facilitate removal of a residual film in a method for molding an article to be molded in which a photosetting material is molded by transferring a fine transfer pattern formed on a mold to the photosetting material.SOLUTION: A method for molding an article to be molded compr...

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Bibliographische Detailangaben
Hauptverfasser:	SHINOHARA HIDETOSHI, HASHIMOTO YUKI, KOKUBO MITSUNORI, OMAGARI HIROAKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To facilitate removal of a residual film in a method for molding an article to be molded in which a photosetting material is molded by transferring a fine transfer pattern formed on a mold to the photosetting material.SOLUTION: A method for molding an article to be molded comprises the steps of: providing an uncured molding material 17 on a base material 11; installing a mold 1 having a substrate 3 composed of a light transmissive material and a plurality of fine recesses 7 composed of a light-shielding material so that a transfer pattern 5 of the mold 1 adheres tightly to the uncured molding material 17; curing a part 17B of the molding material 17 by irradiating the molding material 17 with light through the substrate 3 of the mold 1; separating the mold 1 from the molding material 17; and removing an uncured molding material 17A.