WIRING BOARD FOR MOUNTING LIGHT EMITTING ELEMENT, LIGHT-EMITTING MODULE, AND METHOD OF MANUFACTURING WIRING BOARD FOR MOUNTING LIGHT EMITTING ELEMENT

PROBLEM TO BE SOLVED: To provide a wiring board for mounting a light emitting element, having less warpage and less warpage variation caused by heating and moisture absorption, capable of providing excellent light reflectivity, excellent in handling property and insulating resistance, and capable of...

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Bibliographische Detailangaben
Hauptverfasser:	IMAI NOBORU, TAGA KATSUTOSHI, ISAKA FUMIYA, ISHIKAWA HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wiring board for mounting a light emitting element, having less warpage and less warpage variation caused by heating and moisture absorption, capable of providing excellent light reflectivity, excellent in handling property and insulating resistance, and capable of mounting the light emitting element, and to provide a light-emitting module and a method of manufacturing the wiring board for mounting a light emitting element.SOLUTION: A wiring board for mounting a light emitting element 1 comprises: a metal pattern 2; a silicone layer 4 having opening parts 3A and 3B which enable mounting of an LED chip (light emitting element) by exposing the metal pattern 2, and containing an addition reaction type silicone which covers an upper face 2a, a lower face 2b, and an edge face of the metal pattern 2; and a resin film 6.