MANUFACTURING METHOD OF PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO CLOCK
PROBLEM TO BE SOLVED: To provide a manufacturing method of a package in which conductivity of the interior and exterior of a cavity can be ensured, and mechanical strength can be ensured by minimizing occurrence of a flaw in a first substrate while polishing, and to provide a package, a piezoelectri...
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| creator | FUNABIKI YOICHI |
| description | PROBLEM TO BE SOLVED: To provide a manufacturing method of a package in which conductivity of the interior and exterior of a cavity can be ensured, and mechanical strength can be ensured by minimizing occurrence of a flaw in a first substrate while polishing, and to provide a package, a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio clock.SOLUTION: A manufacturing method of a package includes a filling step for filling between the through holes 21, 22 and the core material 31 of a metal pin 37 with a glass frit 38, a calcination step for hardening the glass frit 38 filling the through holes 21, 22 by calcination, and a polishing step for exposing the core material 31 of the metal pin 37 by polishing a region of a wafer 40 for a base substrate filled with the glass frit 38 by using an abrasive material where abrasive grains having a grain size of 0.5-5 μm are dispersed. In the calcination step, the calcination temperature of the glass frit 38 is set above the crystallization temperature and below 580°C. |
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In the calcination step, the calcination temperature of the glass frit 38 is set above the crystallization temperature and below 580°C.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BASIC ELECTRONIC CIRCUITRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION OF NOISE BY SUCH CIRCUITS ; GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER ; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS ; RESONATORS ; SEMICONDUCTOR DEVICES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130704&DB=EPODOC&CC=JP&NR=2013131854A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130704&DB=EPODOC&CC=JP&NR=2013131854A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUNABIKI YOICHI</creatorcontrib><title>MANUFACTURING METHOD OF PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO CLOCK</title><description>PROBLEM TO BE SOLVED: To provide a manufacturing method of a package in which conductivity of the interior and exterior of a cavity can be ensured, and mechanical strength can be ensured by minimizing occurrence of a flaw in a first substrate while polishing, and to provide a package, a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio clock.SOLUTION: A manufacturing method of a package includes a filling step for filling between the through holes 21, 22 and the core material 31 of a metal pin 37 with a glass frit 38, a calcination step for hardening the glass frit 38 filling the through holes 21, 22 by calcination, and a polishing step for exposing the core material 31 of the metal pin 37 by polishing a region of a wafer 40 for a base substrate filled with the glass frit 38 by using an abrasive material where abrasive grains having a grain size of 0.5-5 μm are dispersed. 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In the calcination step, the calcination temperature of the glass frit 38 is set above the crystallization temperature and below 580°C.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION OF NOISE BY SUCH CIRCUITS GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES |
| title | MANUFACTURING METHOD OF PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO CLOCK |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-01T12%3A46%3A43IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FUNABIKI%20YOICHI&rft.date=2013-07-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2013131854A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |