MANUFACTURING METHOD OF PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO CLOCK

PROBLEM TO BE SOLVED: To provide a manufacturing method of a package in which conductivity of the interior and exterior of a cavity can be ensured, and mechanical strength can be ensured by minimizing occurrence of a flaw in a first substrate while polishing, and to provide a package, a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio clock.SOLUTION: A manufacturing method of a package includes a filling step for filling between the through holes 21, 22 and the core material 31 of a metal pin 37 with a glass frit 38, a calcination step for hardening the glass frit 38 filling the through holes 21, 22 by calcination, and a polishing step for exposing the core material 31 of the metal pin 37 by polishing a region of a wafer 40 for a base substrate filled with the glass frit 38 by using an abrasive material where abrasive grains having a grain size of 0.5-5 μm are dispersed. In the calcination step, the calcination temperature of the glass frit 38 is set above the crystallization temperature and below 580°C.