ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide an electronic component and an electronic device capable of making a connection section fine, and securing connection reliability.SOLUTION: An electronic component 100 comprises a semiconductor chip 2, a wiring board 1 provided with a wiring part 15 connected to the...

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Bibliographische Detailangaben
1. Verfasser:	SAITO TOMOYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electronic component and an electronic device capable of making a connection section fine, and securing connection reliability.SOLUTION: An electronic component 100 comprises a semiconductor chip 2, a wiring board 1 provided with a wiring part 15 connected to the semiconductor chip 2, and a resin part 20 provided on the wiring board 1 while covering a connection portion of the semiconductor chip 2 and the wiring part 15. A semiconductor chip 2 has a first bump and a second bump arranged in a zigzag manner and connected to the wiring part 15. The first bump is arranged inside the semiconductor chip to the second bump, and length of the first bump is longer than that of the second bump.