SILICONE RESIN BASE MATERIAL

PROBLEM TO BE SOLVED: To provide a hard and robust silicone resin base material which can be used for a substrate or a package of an optical element and an electrical element such as a light-emitting diode, which can withstand a lead-free reflow enabling a precise formation without causing a sink ma...

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Bibliographische Detailangaben
Hauptverfasser:	TAZAKI MASUJI, TAKAGI KAZUHISA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a hard and robust silicone resin base material which can be used for a substrate or a package of an optical element and an electrical element such as a light-emitting diode, which can withstand a lead-free reflow enabling a precise formation without causing a sink mark, which does not yellow or degrade due to light or heat, and which can undergo a surface processing such as plating.SOLUTION: The silicone resin base material 1 includes a binder 2 three-dimensionally bridged by polysiloxane compound having diphenyl siloxy group and/or dimethyl siloxy group, alkyloxy silyl group, and the like, as well as a filler 3 including titanium oxide powder or alumina powder contained in the polysiloxane compound, wherein the reflectance at 420 nm or longer is at least 90% when the filler contains the titanium oxide powder and at least 80% when the filler contains the alumina powder.