METHOD FOR MANUFACTURING HERMETICALLY SEALED MICRO DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a high quality hermetically sealed micro device, in which a structure that enlarges an effective surface area and exerts a high getter action is easily achieved at a low cost, and a high degree of vacuum is maintained over a long period in...

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1. Verfasser: FUSE AKIHIRO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for manufacturing a high quality hermetically sealed micro device, in which a structure that enlarges an effective surface area and exerts a high getter action is easily achieved at a low cost, and a high degree of vacuum is maintained over a long period in a device using a vacuum package without enlarging a getter material itself.SOLUTION: There is provided the method for manufacturing the hermetically sealed micro device having a vacuum package structure including the getter material in a sealed space. The getter material deposits a film through a mask using regularly arranged spherical fine particle assembly as the mask, and then forms the spherical fine particle assembly by selectively removing it. The getter material has a regular assembly of a fine projection shape and side faces of projections the getter material has are shapes of recesses being regularly arranged two-dimensionally. The shape of the recesses is composed of a part or the whole of a hemispherical recessed surface.