WIRING BODY WITH WIRING SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a wiring body with a wiring sheet capable of mounting a small-sized switching element without depending on wire connection, and to provide a semiconductor device and a method for manufacturing the semiconductor device.SOLUTION: A wiring body 35 with a wiring sheet is...

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Bibliographische Detailangaben
Hauptverfasser: ARIYOSHI TAKESHI, SAITO HIROHISA, UENISHI NAOTA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a wiring body with a wiring sheet capable of mounting a small-sized switching element without depending on wire connection, and to provide a semiconductor device and a method for manufacturing the semiconductor device.SOLUTION: A wiring body 35 with a wiring sheet is a wiring body having at least one switching element 10 arranged thereon, and is mainly used as a wiring body of a semiconductor device 1 for power control. The wiring body 35 with the wiring sheet includes a first conductor 31 having a solder connection portion 31C connected to a source electrode 14 of the switching element 10, a first electrode terminal 40, and a wiring sheet 60 provided with a gate terminal 64 connected to a gate electrode 15 of the switching element 10. The gate terminal 64 of the wiring sheet 60 and the solder connection portion 31C of the first conductor 31 are arranged on the same plane.