HEAT COUNTERMEASURE SHEET

PROBLEM TO BE SOLVED: To provide a heat countermeasure sheet which has a simple configuration and is excellent in thermal diffusion and heat insulation performance.SOLUTION: A heat countermeasure sheet A includes: a base sheet layer 100A, i.e., a copper foil having a thickness of 35 μm and made of e...

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Hauptverfasser:	IZUMI MISAO, MORINAGA AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat countermeasure sheet which has a simple configuration and is excellent in thermal diffusion and heat insulation performance.SOLUTION: A heat countermeasure sheet A includes: a base sheet layer 100A, i.e., a copper foil having a thickness of 35 μm and made of electrolytic copper; and a heat-insulating coating layer 200A applied to one surface of the base sheet layer 100A and having a thickness of 50-1000 μm. The heat-insulating coating layer 200A contains fine hollow particles.