FORCE SENSOR

PROBLEM TO BE SOLVED: To achieve downsizing and cost reduction while securing high reliability.SOLUTION: An integral structure is prepared by arranging a disk-like force receiver 300 under a disk-like flexure element 100 and connecting the force receiver 300 and the flexure element 100 by a cylindri...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NISHIOKI NOBUHISA, OKADA KAZUHIRO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To achieve downsizing and cost reduction while securing high reliability.SOLUTION: An integral structure is prepared by arranging a disk-like force receiver 300 under a disk-like flexure element 100 and connecting the force receiver 300 and the flexure element 100 by a cylindrical connection member 200. A detecting groove G is dug on the inside of a contour line f1 of an upper surface of the flexure element 100. The bottom of the detecting groove G forms a diaphragm part 110 and a square flexure detecting base plate 400 composed of silicon is joined to the upper surface of the diaphragm part 110. The lower surface of the diaphragm part 110 and the lower surface of a sidewall part 120 around the diaphragm part 110 are aligned on the same plane. Piezoresistive elements A are formed along an X axis and a Y axis just close to the outside of a junction part of the connection member 200 on the upper surface of the flexure detecting base plate 400. A bridge circuit utilizing the piezoresistive elements A is formed on a circuit board 500, and a moment component Mx around the X axis, a moment component My around the Y axis and a force component Fz in a Z-axis direction are respectively outputted as bridge voltages.