RESIN COMPOSITION AND HEAT INSULATING MEMBER FORMED OF THE SAME

PROBLEM TO BE SOLVED: To provide a resin composition hardly causing breakage of its hollow particles during a kneading or molding process and having excellent heat insulating properties (typically, heat sensitivity) and lightweight properties; and a heat insulating member formed of the resin composi...

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Bibliographische Detailangaben
Hauptverfasser:	HAMADA KENICHI, KURIHARA TOYOAKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition hardly causing breakage of its hollow particles during a kneading or molding process and having excellent heat insulating properties (typically, heat sensitivity) and lightweight properties; and a heat insulating member formed of the resin composition.SOLUTION: The resin composition includes 20-95 mass% of a (meth)acrylic block copolymer and 5-80 mass% of the hollow particles. The heat insulating member formed of the resin composition is also provided.