VIA POSITION DETECTION METHOD BY BACKSCATTERED ELECTRON IMAGE

PROBLEM TO BE SOLVED: To provide a method of non-destructively detecting a position of a via located on a lower part of wiring and further a position of a via sandwiched by wiring layers by using a backscattered electron image.SOLUTION: A method of detecting a position of a via connecting upper layer wiring and lower layer wiring in a semiconductor, comprises: a step of forming a carbon film 40 by a focused ion beam system on the upper layer wiring in which a via 30 is arranged and in a range including a position of the via 30; and a step of generating a backscattered electron image of the upper layer wiring including a range where the carbon film 40 is formed and a lower layer of the upper layer wiring layer by backscattered electrons by using an electronic microscope device.