PLATING APPARATUS

PROBLEM TO BE SOLVED: To form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of plating objects, such as a semiconductor wafer, is carried out under high-current density conditions.SOLUTION: The plating apparatus includes: a plating tank 10...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KAMIMURA KENJI, SAITO NOBUTOSHI, YAMAMOTO TADAAKI, FUJIKATA JUNPEI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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