PLATING APPARATUS

PROBLEM TO BE SOLVED: To form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of plating objects, such as a semiconductor wafer, is carried out under high-current density conditions.SOLUTION: The plating apparatus includes: a plating tank 10 for holding a plating solution Q; an anode 26 to be immersed in the plating solution in the plating tank 10; a holder 24 for holding a plating object W and disposing the plating object at a position opposite the anode; a paddle 32, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section 46 for controlling a paddle drive section 42 which drives the paddle. The plating tank is separated into a plating object processing chamber 84 and a plating solution distribution chamber 86 by a separation plate 80 having plating solution passage holes thereinside. The plating solution distribution chamber is provided with a shield plate 82 for regulating an electric field while ensuring distributed flows of the plating solution.