SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method that can securely prevent over-baking without providing a dedicated cooling mechanism.SOLUTION: Substrates which are fed one after another are each conveyed to one of cooling units CP1-CP3 which are f...

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Bibliographische Detailangaben
Hauptverfasser:	HASHIMOTO KATSUMI, MATSUSHITA TAKASHI, NAKANISHI MANABU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FURNACES FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL HEATING KILNS LIGHTING MECHANICAL ENGINEERING OPEN SINTERING OR LIKE APPARATUS OVENS RETORTS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method that can securely prevent over-baking without providing a dedicated cooling mechanism.SOLUTION: Substrates which are fed one after another are each conveyed to one of cooling units CP1-CP3 which are free, the cooling unit is reserved as a unit to perform cooling processing on the substrate W after after-exposure baking processing, and reservation information on it is stored. After one of the cooling units CP1-CP3 is reserved in advance before the after-exposure baking processing, the substrate W is conveyed from the cooling unit to one of heating units PEB1-PEB3 without performing cooling processing to perform after-exposure baking processing. After the after-exposure baking processing is completed, the substrate W is conveyed from the heating unit to the cooling unit having been reserved in advance to be subjected to the cooling processing.