VAPOR DEPOSITION SOURCE

PROBLEM TO BE SOLVED: To provide a vapor deposition source.SOLUTION: The vapor deposition source includes: a heating furnace; a first heater arranged covering around the heating furnace to apply heat to the heating furnace; and a second heater arranged covering around the heating furnace while being...

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Bibliographische Detailangaben
Hauptverfasser:	LEE JONG WOO, JI CHANG-SOON, KAN SHOSHIN, KIM TAE SEUNG, CHO WON-SEOK, SHIM HEY-YEON, JO YONG-HUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a vapor deposition source.SOLUTION: The vapor deposition source includes: a heating furnace; a first heater arranged covering around the heating furnace to apply heat to the heating furnace; and a second heater arranged covering around the heating furnace while being spaced apart from the first heater at a predetermined interval. The second heater includes a plurality of sub-heaters spaced apart from each other. The plurality of sub-heaters cover around the heating furnace while being spaced apart from each other. The sub-heaters each are arranged so as to correspond to different regions of the heating furnace and heat the different regions of the heating furnace.