HEAT RAY-SHIELDING NANOPARTICLE-CONTAINING COMPOSITION, METHOD OF PRODUCING THE SAME, HEAT RAY-SHIELDING FILM, AND HEAT RAY-SHIELDING LAMINATED TRANSPARENT BASE MATERIAL

PROBLEM TO BE SOLVED: To provide a heat ray-shielding film that mainly includes a polyvinylacetal resin, uses composite tungsten oxide nanoparticles having high heat ray-shielding effect, and exhibits excellent optical properties and high weatherability.SOLUTION: A heat ray-shielding nanoparticle-co...

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Hauptverfasser:	MACHIDA YOSHISUKE, FUJITA KENICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MINERAL OR SLAG WOOL ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat ray-shielding film that mainly includes a polyvinylacetal resin, uses composite tungsten oxide nanoparticles having high heat ray-shielding effect, and exhibits excellent optical properties and high weatherability.SOLUTION: A heat ray-shielding nanoparticle-containing composition comprises: composite tungsten oxide nanoparticles that is shown by general formula: MWOand has a hexagonal crystal geometry; a dispersant I that has an acrylic structure on its main chain, has an amino group as a functional group, and has a decomposition temperature of 200°C or larger; and a dispersant II that has an acrylic structure on its main chain, has an epoxy group as a functional group, and has a decomposition temperature of 200°C or larger, wherein the content of an organic solvent at a boiling point of 120°C or lower is 5 mass% or lower.