APPARATUS FOR MOUNTING SEMICONDUCTOR CHIP

PROBLEM TO BE SOLVED: To provide an apparatus for mounting semiconductor chips that can be adjusted by an easy method.SOLUTION: An apparatus for mounting semiconductor chips 12 can be operated in a direct mode and a parallel mode. In the direct mode, a carriage 6 is in a first position, and a control unit 9 operates a pick and place system 4 to cause a bonding head 5 to move the semiconductor chips 12 from a wafer table 1 to a substrate 2. In the parallel mode, the carriage 6 is in a second position, and the control unit 9 operates a picking head 7, a support table 8, and the pick and place system 4 to cause the picking head 7 to move the semiconductor chips 12 from the wafer table 1 to the support table 8 and the bonding head 5 to move the semiconductor chips 12 from the support table 8 to the substrate 2.