HEAT DISSIPATION MEMBER, ELECTRONIC COMPONENT AND MOUNTING BOARD

PROBLEM TO BE SOLVED: To provide a compact and lightweight heat dissipation member which can cool a heating component quickly by taking the heat from a heating component such as a semiconductor element.SOLUTION: The heat dissipation member 1 has a top 11 for connecting a heating component, a bottom...

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Hauptverfasser:	HORIUCHI MEGUMI, OBATA MOTOKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a compact and lightweight heat dissipation member which can cool a heating component quickly by taking the heat from a heating component such as a semiconductor element.SOLUTION: The heat dissipation member 1 has a top 11 for connecting a heating component, a bottom 12 for connection to a board, and a hollow body 10 provided with the connection wiring 13 of the top 11 and the bottom 12, and incorporates a cooling medium 14, and a capillary structure 15 for causing capillary movement of the cooling medium 14 between the bottom 12 and the top 11. Preferably, the capillary structure 15 is a porous body or a fibrous structure. An integrated electronic component may be obtained by connecting a heating component to the top 11 of the heat dissipation member 1.