SEMICONDUCTOR DEVICE FOR POWER CONTROL

PROBLEM TO BE SOLVED: To provide a semiconductor device sealed with a molding resin for power control with high dielectric strength.SOLUTION: A semiconductor device 1 for power control includes: a first electrode terminal 40 having an electrode part 40A on a low-voltage side; a second electrode term...

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Bibliographische Detailangaben
Hauptverfasser:	ARIYOSHI TAKESHI, SAITO HIROHISA, UENISHI NAOTA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor device sealed with a molding resin for power control with high dielectric strength.SOLUTION: A semiconductor device 1 for power control includes: a first electrode terminal 40 having an electrode part 40A on a low-voltage side; a second electrode terminal 50 having an electrode part 50A on a high-voltage side; a switching element 10 connected to the electrode parts 40A and 50A; and a sealing part 80 sealing the switching element 10 with a molding resin. Insulating sheets 43 and 53 are provided on second surfaces 42 and 52 of the electrode parts 40A and 50A so as to be exposed from the sealing part 80. The insulating sheets 43 and 53 have a shape larger than the second surfaces 42 and 52.