ALIGNMENT METHOD BETWEEN RESIN FILM AND SUBSTRATE

PROBLEM TO BE SOLVED: To provide an alignment method which can align an odd-shaped pattern of a resin film with an intended position of a substrate even when the resin film undergoes change of form.SOLUTION: An alignment method of aligning a resin film 11 having a micro odd-shaped pattern formed on...

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI TAKAHIRO, AKAMA HIDEHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an alignment method which can align an odd-shaped pattern of a resin film with an intended position of a substrate even when the resin film undergoes change of form.SOLUTION: An alignment method of aligning a resin film 11 having a micro odd-shaped pattern formed on a surface and a substrate 15 having a photo-curing resin layer 16 on which the odd-shaped pattern is to be transferred when bonding the resin film 11 with the substrate 15, comprises a step of extending the resin film 11 of a polygonal planar shape in a planar direction while holding the resin film 11 at edges but not at vertexes.