CONDUCTIVE PASTE COMPOSITION AND CONDUCTIVE ADHESIVE AGENT

PROBLEM TO BE SOLVED: To provide a conductive paste composition that is excellent in the mechanical strength, the heat resistance, the humidity resistance, the flexibility, the thermal cycle resistance, the solder reflow resistance, the dimension stability and the like after hardening, and that show...

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Bibliographische Detailangaben
Hauptverfasser:	ANDO NORIYOSHI, AIZAWA TAKAYUKI, MORIUCHI FUMIO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a conductive paste composition that is excellent in the mechanical strength, the heat resistance, the humidity resistance, the flexibility, the thermal cycle resistance, the solder reflow resistance, the dimension stability and the like after hardening, and that shows a high adhesion reliability and a high conduction reliability if used as a conduction material.SOLUTION: A conductive paste composition contains (A) epoxy resin, (B) polyvinyl acetal resin, (C) rosin derivative, (D) epoxy resin hardener, and (E) metal fine particles having a center particle diameter of 10 nm to 30 μm.