PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMING METHOD AND PRINT CIRCUIT BOARD MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition in which sensitivity and resolution are sufficiently improved and tent reliability is sufficiently excellent, and a photosensitive element, a resist pattern forming method and a print circuit board manufacturing method using the pho...

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Hauptverfasser:	MURAMATSU YUKIKO, MIYASAKA MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition in which sensitivity and resolution are sufficiently improved and tent reliability is sufficiently excellent, and a photosensitive element, a resist pattern forming method and a print circuit board manufacturing method using the photosensitive resin composition.SOLUTION: A photosensitive resin composition includes a binder polymer having a dispersion degree of 1.6 or less, a photopolymerizable compound, and a photopolymerization initiator including an acridine compound with one or two acridinyl group(s).