EPOXY RESIN SOLUTION, EPOXY RESIN COMPOSITION, HARDENED MATERIAL AND ADHESIVE

PROBLEM TO BE SOLVED: To provide an epoxy resin solution and an epoxy resin composition which are excellent in adhesiveness and chemical resistance when made into varnish, a hardened material obtained by hardening the epoxy resin composition, and an adhesive including the epoxy resin composition.SOL...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NIIMURA TAKAYA, SATO YOSHINOBU, TOBE AKIFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin solution and an epoxy resin composition which are excellent in adhesiveness and chemical resistance when made into varnish, a hardened material obtained by hardening the epoxy resin composition, and an adhesive including the epoxy resin composition.SOLUTION: The epoxy resin solution includes an epoxy resin obtained by reacting a (poly)alkylene glycol diglycidylether (X), a polyphenol compound (Y) and an epoxy resin (Z) having aromatic ring; and an organic solvent.