MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed circuit board.SOLUTION: A manufacturing method of a printed circuit board of this invention includes the steps of: removing parts of copper foil formed on both surfaces of a base substrate to expose a base layer; forming a through...

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Bibliographische Detailangaben
Hauptverfasser:	JOUNG DA HEE, PARK JIN-MO, KOO BONG WAN, BON CHANG SUK, LEE SUNG JUN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed circuit board.SOLUTION: A manufacturing method of a printed circuit board of this invention includes the steps of: removing parts of copper foil formed on both surfaces of a base substrate to expose a base layer; forming a through hole in an exposure region of the base layer; performing desmear treatment on the through hole to form a via hole; forming a plating layer in the via hole; and forming circuit patterns electrically connected by the plating layer filling the via hole.