SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor package and a method of manufacturing the same which utilize contractile force on curing of resin in order to cope with a warpage phenomenon occurring in a substrate or package at high temperature as well as can increase a yield by reducing defective...

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Bibliographische Detailangaben
Hauptverfasser:	HONG JONG KUK, SOHN KEUNG JIN, PARK JUNG HWAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor package and a method of manufacturing the same which utilize contractile force on curing of resin in order to cope with a warpage phenomenon occurring in a substrate or package at high temperature as well as can increase a yield by reducing defective phenomena such as non-wetting and bump cracking at package reflow.SOLUTION: A semiconductor package 100 includes: a substrate 110 having one surface and the other surface; a semiconductor device 120 mounted on the one surface of the substrate 110; external connection terminals 111 formed on the other surface of the substrate 110; and a warpage preventing layer 130 formed on the one surface of the substrate 110 or the other surface of the substrate 110.