ELECTROMAGNETIC WAVE SHIELD MATERIAL FOR FPC

PROBLEM TO BE SOLVED: To provide an electromagnetic wave shield material for an FPC, causing no peeling due to water vapor generated by rapidly heating moisture in a film, having thin thickness with high flexibility, causing no deterioration in electromagnetic wave shield performance even after seve...

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Bibliographische Detailangaben
Hauptverfasser:	GOTO NOBUHIRO, FUJII SANAE, NOMURA NAOHIRO, INABA YUKO, SAKURAGI TAKANORI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electromagnetic wave shield material for an FPC, causing no peeling due to water vapor generated by rapidly heating moisture in a film, having thin thickness with high flexibility, causing no deterioration in electromagnetic wave shield performance even after severe bending operation is repeated, and excellent in bending characteristics.SOLUTION: In an electromagnetic wave shield material 10 for an FPC, a base material 1 comprising a thin resin film of a coated dielectric, a thin film adhesive layer 2, a conductive paste layer 3 and a conductive adhesive layer 4 are laminated, in order, on one side of a support film 6. The base material 1 has a water vapor permeability of 500 g/mday or more.