ELECTRONIC COMPONENT PACKAGE, SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE, AND MANUFACTURING METHOD OF SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE

ELECTRONIC COMPONENT PACKAGE, SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE, AND MANUFACTURING METHOD OF SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE

PROBLEM TO BE SOLVED: To increase a mounting region of an electronic component element in a cavity.SOLUTION: A sealing member for an electronic component package hermetically seals an electrode of an electronic component element 2 with multiple sealing members. In the sealing member for the electron...

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BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
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description PROBLEM TO BE SOLVED: To increase a mounting region of an electronic component element in a cavity.SOLUTION: A sealing member for an electronic component package hermetically seals an electrode of an electronic component element 2 with multiple sealing members. In the sealing member for the electronic component package, a cavity 45 in which the electronic component element 2 is mounted is formed on a base 4. A wall surface 451 of the cavity 45 includes curve surfaces (a second wall surface 454, a curve surface 4552 of a third wall surface 455), each of which is formed by an aggregate of points radially spreading from preset reference points of the cavity 45 and expands to the outer side in the width direction.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2013105788A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2013105788A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2013105788A3</originalsourceid><addsrcrecordid>eNrjZJjl6uPqHBLk7-fprODs7xvg7-fqF6IQ4Ojs7ejuqqMQ7Oro4-nnruDr6uvkGqTg5h-kgF-Do5-Lgq-jX6ibo3NIaBBEa4iHv4uCvxuphvEwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDQ2NDA1NzCwtHY6IUAQAxK0Np</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC COMPONENT PACKAGE, SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE, AND MANUFACTURING METHOD OF SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE</title><source>esp@cenet</source><creator>KODA NAOKI</creator><creatorcontrib>KODA NAOKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To increase a mounting region of an electronic component element in a cavity.SOLUTION: A sealing member for an electronic component package hermetically seals an electrode of an electronic component element 2 with multiple sealing members. In the sealing member for the electronic component package, a cavity 45 in which the electronic component element 2 is mounted is formed on a base 4. A wall surface 451 of the cavity 45 includes curve surfaces (a second wall surface 454, a curve surface 4552 of a third wall surface 455), each of which is formed by an aggregate of points radially spreading from preset reference points of the cavity 45 and expands to the outer side in the width direction.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BASIC ELECTRONIC CIRCUITRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS ; RESONATORS ; SEMICONDUCTOR DEVICES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130530&amp;DB=EPODOC&amp;CC=JP&amp;NR=2013105788A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130530&amp;DB=EPODOC&amp;CC=JP&amp;NR=2013105788A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KODA NAOKI</creatorcontrib><title>ELECTRONIC COMPONENT PACKAGE, SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE, AND MANUFACTURING METHOD OF SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE</title><description>PROBLEM TO BE SOLVED: To increase a mounting region of an electronic component element in a cavity.SOLUTION: A sealing member for an electronic component package hermetically seals an electrode of an electronic component element 2 with multiple sealing members. In the sealing member for the electronic component package, a cavity 45 in which the electronic component element 2 is mounted is formed on a base 4. A wall surface 451 of the cavity 45 includes curve surfaces (a second wall surface 454, a curve surface 4552 of a third wall surface 455), each of which is formed by an aggregate of points radially spreading from preset reference points of the cavity 45 and expands to the outer side in the width direction.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</subject><subject>RESONATORS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJjl6uPqHBLk7-fprODs7xvg7-fqF6IQ4Ojs7ejuqqMQ7Oro4-nnruDr6uvkGqTg5h-kgF-Do5-Lgq-jX6ibo3NIaBBEa4iHv4uCvxuphvEwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDQ2NDA1NzCwtHY6IUAQAxK0Np</recordid><startdate>20130530</startdate><enddate>20130530</enddate><creator>KODA NAOKI</creator><scope>EVB</scope></search><sort><creationdate>20130530</creationdate><title>ELECTRONIC COMPONENT PACKAGE, SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE, AND MANUFACTURING METHOD OF SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE</title><author>KODA NAOKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2013105788A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</topic><topic>RESONATORS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KODA NAOKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KODA NAOKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC COMPONENT PACKAGE, SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE, AND MANUFACTURING METHOD OF SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE</title><date>2013-05-30</date><risdate>2013</risdate><abstract>PROBLEM TO BE SOLVED: To increase a mounting region of an electronic component element in a cavity.SOLUTION: A sealing member for an electronic component package hermetically seals an electrode of an electronic component element 2 with multiple sealing members. In the sealing member for the electronic component package, a cavity 45 in which the electronic component element 2 is mounted is formed on a base 4. A wall surface 451 of the cavity 45 includes curve surfaces (a second wall surface 454, a curve surface 4552 of a third wall surface 455), each of which is formed by an aggregate of points radially spreading from preset reference points of the cavity 45 and expands to the outer side in the width direction.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
title ELECTRONIC COMPONENT PACKAGE, SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE, AND MANUFACTURING METHOD OF SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T17%3A39%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KODA%20NAOKI&rft.date=2013-05-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2013105788A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true