ELECTRONIC COMPONENT PACKAGE, SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE, AND MANUFACTURING METHOD OF SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE

PROBLEM TO BE SOLVED: To increase a mounting region of an electronic component element in a cavity.SOLUTION: A sealing member for an electronic component package hermetically seals an electrode of an electronic component element 2 with multiple sealing members. In the sealing member for the electron...

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Bibliographische Detailangaben
1. Verfasser:	KODA NAOKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To increase a mounting region of an electronic component element in a cavity.SOLUTION: A sealing member for an electronic component package hermetically seals an electrode of an electronic component element 2 with multiple sealing members. In the sealing member for the electronic component package, a cavity 45 in which the electronic component element 2 is mounted is formed on a base 4. A wall surface 451 of the cavity 45 includes curve surfaces (a second wall surface 454, a curve surface 4552 of a third wall surface 455), each of which is formed by an aggregate of points radially spreading from preset reference points of the cavity 45 and expands to the outer side in the width direction.