PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a printed wiring board in which decline in properties due to thinning caused by etching of a second metal layer, and reduction of reliability due to ion residue can be limited by preventing side etching of a first metal layer 3 occurring when removing the first metal layer 3 between wiring patterns by etching, and to provide a manufacturing method therefor.SOLUTION: A first metal layer is formed on the surface of an insulating substrate, followed by formation of the resist pattern of negative pattern of a wiring pattern to be formed. After forming a second metal layer in a part where the resist pattern is not formed, the resist pattern is removed, and then the first metal layer is removed by etching the first metal layer and the second metal layer simultaneously. Thereafter, the side face of the wiring pattern thus formed is coated entirely with a third metal layer, and the exposed resin of the insulating substrate is removed.