SEMICONDUCTOR DEVICE AND WIRING BOARD

PROBLEM TO BE SOLVED: To provide a semiconductor device and a wiring board which are capable of achieving high reliability.SOLUTION: A semiconductor device 10 according to one embodiment includes an insulating substrate 121, a wiring layer 122 formed on a first main surface 121a of the insulating su...

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Bibliographische Detailangaben
Hauptverfasser:	CHIKUNO TAKASHI, HAYASHI HIDEKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor device and a wiring board which are capable of achieving high reliability.SOLUTION: A semiconductor device 10 according to one embodiment includes an insulating substrate 121, a wiring layer 122 formed on a first main surface 121a of the insulating substrate and having electrical conductivity, and a semiconductor element 14 mounted on the wiring layer. In the semiconductor device, the insulating substrate is constituted of cBN or diamond.