LIQUID PROCESSING DEVICE, LIQUID PROCESSING METHOD, AND RECORDING MEDIUM

PROBLEM TO BE SOLVED: To clean a substrate support part for supporting a substrate or a top board rotating with the substrate by using a rinse liquid supplied to the substrate, during a liquid processing step.SOLUTION: A liquid processing device 100 includes: a rotatable substrate support part 10 fo...

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Bibliographische Detailangaben
Hauptverfasser:	NAGAMINE SHUICHI, HASHIMOTO YUSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To clean a substrate support part for supporting a substrate or a top board rotating with the substrate by using a rinse liquid supplied to the substrate, during a liquid processing step.SOLUTION: A liquid processing device 100 includes: a rotatable substrate support part 10 for supporting a wafer W from above; and a top plate nozzle 10n provided in a rotation center of the substrate support part 10, for supplying at least a rinse liquid to the wafer W. The top plate nozzle 10n is vertically movable with respect to the substrate support part 10, and the rinse liquid is supplied to the wafer W from the top plate nozzle 10n in a state in which the top plate nozzle 10n is spaced from the substrate support part 10. The rinse liquid is supplied from the top plate nozzle 10n to a lower surface of the top plate nozzle 10n to clean the wafer in a state in which the top plate nozzle 10n is close to the substrate support part 10.