FILM REMOVAL METHOD

PROBLEM TO BE SOLVED: To provide a film removal method by which a parylene film can be efficiently removed without damaging a base material of a component.SOLUTION: The film removal method for removing a parylene film P adhered to a component B of a film deposition apparatus when depositing the pary...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAHASHI SHOJIRO, SHIMADA TETSUYA, SUZUKI HIDEO, MIYAUCHI ATSUSHI, ODAGI HIDEYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY CLEANING CLEANING IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a film removal method by which a parylene film can be efficiently removed without damaging a base material of a component.SOLUTION: The film removal method for removing a parylene film P adhered to a component B of a film deposition apparatus when depositing the parylene film on an object for film deposition by using the film deposition apparatus includes a blast step of spraying and blasting pellet-like dry ice on a surface of a deposition-preventive sheet of a component B with the parylene film P being deposited thereon. A heating step of heating the deposition-preventive sheet may be further included prior to the blast step.