MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE

PROBLEM TO BE SOLVED: To provide a member for semiconductor manufacturing device which is not prone to causing component contamination, and which in addition sufficiently reduces production of particles in semiconductor manufacturing device.SOLUTION: A high-temperature ceramic layer 5 is formed of a...

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Bibliographische Detailangaben
Hauptverfasser:	YOKOTA HIRONORI, INABA MITSUHARU, YAMADA KEISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a member for semiconductor manufacturing device which is not prone to causing component contamination, and which in addition sufficiently reduces production of particles in semiconductor manufacturing device.SOLUTION: A high-temperature ceramic layer 5 is formed of a recrystallized ceramic obtained by thermally spraying a ceramic onto the mounting member 16 of a transfer arm 1 to form a thermal spray coating, irradiating this thermal spray coating with a laser beam, and modifying the ceramic composition by re-melting and re-solidifying. Thus, due to external factors in the semiconductor manufacturing device 50, particles falling off of the mounting member 16 are decreased to a degree that the semiconductor manufacturing process is not affected.