FILLING DEVICE OF CONDUCTIVE BALL

FILLING DEVICE OF CONDUCTIVE BALL

PROBLEM TO BE SOLVED: To provide a device for filling a plurality of openings with conductive balls while aligning a mask having the plurality of openings used for arranging conductive balls on a substrate with the substrate.SOLUTION: The filling device includes a head 20 for forming a population 16...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KAWAKAMI SHIGEAKI, NEHASHI TORU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a device for filling a plurality of openings with conductive balls while aligning a mask having the plurality of openings used for arranging conductive balls on a substrate with the substrate.SOLUTION: The filling device includes a head 20 for forming a population 16 of conductive balls having a two-dimensional spread in a zone 26 of a part on the surface of a mask 11 having a two-dimensional limited spread that is a movement destination zone of the surface of a mask 11, means for moving the head 20, and a ball supply device 60 being moved together with the head 20 and replenishing the population 16 of conductive balls having a two-dimensional spread with conductive balls.