MANUFACTURING METHOD OF PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a wiring board in which the boundary surface of a base material and a metal fine particle sintered film is smooth and adhesion of the base material and metal fine particle sintered film is high, by forming a metal fine particle sintered film such as copper wiring on...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HOJO MIKIKO, YOSHI NAONOBU
Format: Patent
Sprache:eng
Schlagworte:
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