MANUFACTURING METHOD OF PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a wiring board in which the boundary surface of a base material and a metal fine particle sintered film is smooth and adhesion of the base material and metal fine particle sintered film is high, by forming a metal fine particle sintered film such as copper wiring on...

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Bibliographische Detailangaben
Hauptverfasser:	HOJO MIKIKO, YOSHI NAONOBU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wiring board in which the boundary surface of a base material and a metal fine particle sintered film is smooth and adhesion of the base material and metal fine particle sintered film is high, by forming a metal fine particle sintered film such as copper wiring on a base material of polyimide, or the like.SOLUTION: The manufacturing method of a printed wiring board includes a step for forming a print layer on a base material by printing a coating liquid containing a metal or metal oxide fine particles, a step for forming a metal fine particle sintered film by calcining the print layer, and a step for obtaining a pattern of metal fine particle sintered film. Average surface roughness of the boundary surface of a base material and a metal fine particle sintered film may be 30 nm or less, by performing the calcination with surface wave plasma generated by applying microwave energy of electromagnetic wave having a frequency of 300 MHz-3000GHz.