HEAT DISSIPATION SUBSTRATE AND ELEMENT USING THE SAME

PROBLEM TO BE SOLVED: To provide a heat dissipation substrate which is excellent in heat dissipation and is free from peeling and short-circuiting.SOLUTION: The present invention provides the heat dissipation substrate which comprises a support base material, an insulating layer formed directly on t...

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Bibliographische Detailangaben
Hauptverfasser:	FUKUDA TOSHIHARU, SAKAYORI KATSUYA, TAKARABE TOSHIMASA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat dissipation substrate which is excellent in heat dissipation and is free from peeling and short-circuiting.SOLUTION: The present invention provides the heat dissipation substrate which comprises a support base material, an insulating layer formed directly on the support base material, and a wiring layer formed directly on the insulating layer and is characterized in that the insulating layer is made of a non-thermoplastic polyimide resin and has a thickness within a range of 1-20 μm.