ELECTRONIC MODULE AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide an electronic module in which a crystal oscillator or a surface acoustic wave device ensuring high reliability for external vibration or mechanical shock is mounted together with other electronic devices.SOLUTION: Terminal parts of a plurality of electronic devices 3...

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Bibliographische Detailangaben
1. Verfasser: TSUDA TOSHIMASA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic module in which a crystal oscillator or a surface acoustic wave device ensuring high reliability for external vibration or mechanical shock is mounted together with other electronic devices.SOLUTION: Terminal parts of a plurality of electronic devices 3a, 3b, 4a, 4b, 5a, 5b are embedded using a resin 6 in a state where the terminal parts are arranged in flush while being exposed on the upper surface on the opposite side of a support substrate 1. A wiring/circuit pattern 8 being connected with a connection electrode or a connection terminal of each electronic component on the exposed surface of each electronic device is formed. An external connection terminal provided at a part of the wiring/circuit pattern 8 is mounted on the mother board of a mounting machine by using solder balls 9.